TADERIS

Main Features/Available Process Modules

TADERIS Tool Features

General
  • Bridge Tool –> all wafers up to 8" (200 mm) diameter can be processed w/o major modifications
  • Option: "simultaneous" processing of wafers with different diameter
  • 12 wafer batch / module to be loaded on a rotatable wafer table (turn table)
  • RF – Etch available at wafer table
  • RF – Bias available on wafer table
  • Variable target-substrate-distance
  • Variable rotation speed of wafer table up to 200 rpm
  • Cathode shutters

Additional Process Modules

TADERIS Double Cathode Version
  • Deposition Module with 2 Sputter-Cathodes
  • Basic chamber identically to the Thick Alumina version
  • Cassette to Cassette handling
  • Standard UHV Transport Module Brooks MX700 with 2 Vacuum load locks
  • Other configurations available on customer request

TADERIS Four Cathode Version
  • Deposition Module with 4 Sputter-Cathodes
  • Basic chamber identically to the Thick Alumina version
  • Cassette to Cassette handling
  • Standard UHV Transport Module Brooks MX700 with 2 Vacuum load locks
  • Other configurations available on customer request

TADERIS Six Cathode Version
  • Deposition Module with 6 Sputter-Cathodes
  • Basic chamber identically to the Thick Alumina version
  • Cassette to Cassette handling
  • Standard UHV Transport Module Brooks MX700 with 2 Vacuum load locks
  • Other configurations available on customer request