Multi-Target-Module with 10 DC/RF Cathodes (LDD)
The Multi-Target-Module (MTM) as a key component of the TIMARIS PVD tool incorporates Linear Dynamic Deposition (LDD) technology in combination with ten sputter targets in one vacuum chamber. This technology is especially designed for deposition of ultra-thin films, magnetic films, high-quality metallic, conductive and insulating films and multiple film stack deposition comprising these materials without the need to break ultra high vacuum. A collinear Aligning Magnetic Field (AMF) can be activated to align the magnetic Easy Axis during deposition of ferromagnetic films if required. The LDD technology is key to delivering world class material uniformity across large wafers and exceptional precise control of ultra thin layer thicknessdown to 1% of a nanometer.

Details:

• DC/RF magnetron, RF diode sputter technology  
• All sputter deposition modes selectable by recipe for all 10 cathodes
• RF bias option
• LDD technology
• Ultra-High-Vacuum technology, base pressure < 5*10-9 Torr 

Two/Three Target Module (LDD)
The Two/Three Target Module incorporates Linear Dynamic Deposition (LDD) technology in combination with two or three sputter targets (customized) in one vacuum chamber. This technology is especially designed for deposition of ultra-thin films, magnetic films, high-quality metallic, conductive and insulating films and multiple film stack deposition comprising these materials without the need to break ultra high vacuum. A collinear Aligning Magnetic Field (AMF) can be activated to align the magnetic Easy Axis during deposition of ferromagnetic films if required. This module is designed for application, where only two or three materials are required for deposition. The LDD technology is key to delivering world class material uniformity across large wafers and exceptional precise control of ultra thin layer thickness down to 1% of a nanometer.

Details:

• DC/RF magnetron, RF diode sputter technology  
• All sputter deposition modes selectable by recipe for all cathodes
• RF bias option
• LDD technology
• Ultra-High-Vacuum technology, base pressure < 5*10-9 Torr

Oxidation Module
The Oxidation module is required to oxidize ultra-thin metallic films into insulating films of very high quality. Such films are required in Tunnel Magneto Resistance layer stacks as tunneling barriers. Typical materials are Al2O3 and MgO. The oxidation can be performed by using a remote plasma provided by a ECWR plasma source. This source generates oxygen ions and radicals of very low adjustable energy. Alternatively, the oxidation can be performed by natural oxidation while exposing the metal film oxygen of low pressure (10 Torr down to 0.1 mTorr). The module geometry (large plasma source, rotational symmetric pump system) ensures a high uniformity of the oxidation. Other applications are surface treatment of wafers by different activated gases (e.g. N2).

Details:

• Low energy remote plasma oxidation  
• Natural oxidation
• Surface treatment by low energetic ions
• Variable distance between substrate and ion source
• Ultra-High-Vacuum technology, base pressure < 1*10-8 Torr

Preclean Module
The Preclean module is used to clean the wafer prior to deposition. This is a standard technique employing sputter etch technology by applying RF power to the wafer. Typically the process removes residual water and other molecules and native oxides by adjusting the etching process parameters. Optionally, this module can also be equipped with an ECWR plasma source. This additional plasma source provides a more flexible etching process (higher etch rates, lower etching energies). The module geometry (large plasma source, rotational symmetric pump system) ensures a high uniformity of the etching.

Details:

• Wafer cleaning, removal of native oxides by sputter etch
• ECWR plasma source as option
• Variable distance between substrate and ion source
• Ultra-High-Vacuum technology,base pressure < 1*10-8 Torr

Combi Module
The Combi – Module comprises both technologies, of oxidation and pre – clean in one module. This is a cost efficient variant, since only one module for two process steps is required. It is mainly envisaged for R&D purposes, where a high throughput is of less importance. The process performance is identical with the Oxidation Module and the PreClean Module.

Details:

• Low energy remote plasma oxidation  
• Natural oxidation
• Surface treatment by low energetic ions
• Wafer cleaning, removal of native oxides by sputter etch
• Variable distance between substrate and ion source
• Ultra-High-Vacuum technology, base pressure < 1*10-8 Torr

Static PVD Module
The static PVD module comprises a standard magnetron cathode with optimized target utilization for high rate sputter deposition of metallic and non-conducting materials for multiple applications. DC magnetron as well as RF magnetron sputter modes are selectable  through a recipe menu. The module is envisaged to be used for deposition of films that do not require the extremely high uniformity that can be achieved by the LDD technology.

Details:

• DC and RF sputter deposition selectable by recipe
• Variable distance between substrate and sputter target
• Ultra-High-Vacuum technology, base pressure < 1*10-8 Torr