| Wafer Materials | Materials Mono Crystalline Silicon, Multi Crystalline Silicon, UMG Silicon |
| Wafer Dimensions | 125 x 125 mm and 156 x 156 mm |
| Wafer Thickness | 150 µm up to 270 µm |
| Output | up to 1,500 wafers/h (single SINGULAR) up to 3,000 wafers/h (two SINGULAR in a line) up to 4,500 wafers/h (three SINGULAR in a line) |
| Footprint | 3 x 5 m for each SINGULAR |
| Main Voltage | 3/PE AC 400 V, 50 or 60 Hz |
| Other Required Utilities | Cooling Water, Compressed Air, Process Gases |
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