LINEA

• Stable modular main frame, completely covered
  by PP-panels
• Integrated systems for bath management, electrical
  cabinets and process control units

• Automated feed-in of a wafer alignment by optional
  multiplex transfer unit
• Automated take-out of wafers by optional single or
  multiplex pick-and-place unit
• Safety interlock of automation interaction

• Motor-driven plastic conveyor chain in interaction
  with o-ring based belt transfer sections guarantees
  a reliable and gentle wafer motion and a minimum of
  mechanical wafer stress
• 6 transport lanes, designed for 156 mm or 125 mm wafer
• Effective media carry-over protection system between process sections
• Transport speed adjustable

• Removal of crystalline surface defects by using
  HF-HNO3 composition
• Fluidised bed process by adjustable up- and downflow streams of acid mixture
• Single side etching optional (polishing)
• High-flow bath recirculation in association with the
  effective chilling system
• Excellent temperature and etch uniformity control

• Short etching process of porous Si layer in cold
  alkaline solution

6 Cleaning

• Acidic cleaning using HF and HCl for effective removal of metal contaminations and native oxides

• Removal of P-SiO2-layer from wafers, formed during
  previous diffusion process
• Ambient cleaning operation for subsequent
  antireflective coating
• Self-limiting HF etch step

• Single side etch of wafer rear side without front
  side treatment
• Excellent edge isolation and parasitic emitter etch,
  using chilled HF/HNO3 compositions

• Intelligent combination of highly effective flow and
  spray rinse
• Cascade system with partial water re-use

• Air jet system, using clean ambient air ensures smooth, perfect uniform and spot-free drying of wafers

• Individual chemical bath management for filling
  and spiking of chemicals and DI-water
• Temperature control of all heated and cooled
  process steps
• Control of recirculation and injection flow rates
• Transport speed control
• Optional online/offline analysis of chemical
  compositions by titration, conductivity measurement
  and/or IR spectroscopy
• DI-water resistivity measurement
• Process data storage and logging
• Single wafer tracking

12 Central Machine Control System

• Siemens SIMATIC S7 PLC system
• PC-based graphical user interface (WINCC)
• Bus systems for internal communication of
  sub-assembly systems
• OPC interfaces for external data exchange
• Safety gas transmitter system (NOX, HF)