Main Features
- Strongly modular, highly integrated design
- High availability (uptime > 95 %)
- Low breakage rate (< 0,1 %)
- Wafer thickness down to 150 μm
- Newly developed, sophisticated low contact wafer transport system
- No mechanical contact on top side
- Up to 6 lanes 156 mm/125 mm wafer
- Homogeneous reproducible etching process by high volume chemical up- and downstream distribution system
- High chemical exchange rate
- Automatic chemical bath management
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