VITRUM II

Inline Wet Process Equipment, Etching, Cleaning & Single Side Coating for Thin-Film Solar Cells

As part of the product family VITRUM the new processing machine, VITRUM II Cover is dedicated to cleaning wrap around coatings at rear sides and edges of thin-film solar cells in a single working step. While the edges and the rear side are cleaned with brushes and chemicals the active layer is protected by means of a process hood. Therefore the VITRUM II Cover is best suited for cleaning after oven processes as well as the etching of undesirable coatings on rear side and edges, for example CdTe or CdS.

The modular design of the VITRUM II allows the easy integration of different process steps according to the requirements of CIS, a-Si or CdTe technology (etching, rear side and substrate edge etching, cleaning and single side coating).

The VITRUM II provides the platform for wet chemical inline process steps: In a CdTe manufacturing line it performs several process steps, starting with glass washing, removal of rear side coating, CdCl2 deposition using a roller, CdCl2 salt removal as well as chemical removal of photoresist.

When producing a thin-film silicon or CIS/CIGS cell, VITRUM is capable of glass washing as well as TCO etching, KCN etching or NH3 treatment respectively. In addition, it also provides NP, DAE and EDTA etching for substrate sizes up to 2,200 mm. With our newly developed and unique soft shower process, an homogeneous, reliable and reproducible etching comparable to batch dipping processes is now a reality. Furthermore, it features several advantages compared with inline dipping baths such as reduced process volume, saving energy and chemicals as well as a higher process speed of up to 5 m/min with minimized carryover.





The design of the VITRUM II features similar piping for all liquid circuits and generously dimensioned installation compartments for optimized maintenance work. lt offers a high cycle rate and due to the modular concept it is easy to integrate into existing production lines. With the new VITRUM II process cost can be reduced substantially.

Main Features

  • Modular design
  • Up to 30 % cost reduction
  • Better accessibility
  • Smaller footprint
  • Low cost of ownership
  • High throughput
  • High availability (uptime > 99 %*)
  • Standard and customer specific substrate sizes up to 2,600 mm
  • Parallel carrier transport for higher throughput
  • Reproducible process results
*depends on application