MRAM Applications

Typical TIMARIS configuration for 300mm MRAM wafer production with full throughput, consisting of:

• 2 Multi-Target-Modules
• 1 Oxidation Module
• 1 Pre-Clean Module
• 1 Transport Module (Brooks GX6000) including two FOUP Loadports 6 Express
• Multiple wafer handling
• Throughput: 18 wafers for a Standard MRAM layer stack
• Software integration: GEM / SECSII Interface
• Performance: MTBF > 250h, MTTR < 4h,
  Uptime > 85%