Available Process Modules Multi-Target-Module with 10 DC/RF
Cathodes (LDD) [1]
- DC/RF magnetron, RF diode sputter technology
- All sputter deposition modes selectable by recipe for all cathodes
- RF bias option
Two/Three-Target-Module with 2 DC/RF
Cathodes (LDD) [2]
- DC/RF magnetron, RF diode sputter technology
- RF bias option
Oxidation Module incl. Low Energy
ECWR Plasma Source [3]
- Low energy remote plasma oxidation
- Natural oxidation
- Surface treatment by low energetic ions
Preclean Module (Sputter Etch,
Option: ECWR Plasma Source) [4]
- Wafer cleaning, removal of native oxides
Combi-module Oxidation & Preclean (Sputter
Etch and Low Energy ECWR Plasma Source)
- Combination of the Oxidation Module and Preclean Module
Static PVD Module with Circular DC/RF Cathode
- High rate deposition of metallic and non-conducting materials for multiple applications
Transport Modules (typically selected according
to customer request)
- Brooks: GX6000 (left) / MX700 (right)
- Asys: 7 facet ΓΈ 300 mm wafer handler
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