Thin Film Heads

Typical TIMARIS configuration for 150/200mm Thin Film Head wafer production. The footprint shown is for a tool for TMR (GMR) sensor fabrication and consists of:

• 1 Multi-Target-Module
• 1 Oxidation Module
• 1 Pre-Clean Module
• 1 Transport Module (Brooks MX700)
• Multiple wafer handling
• Throughput: 9 wafers for a standard TMR layer stack
• Software integration: GEM / SECSII Interface
• Performance: MTBF > 250h, MTTR < 4h,
  Uptime > 85%
• Variants: HMM film deposition (no oxidation module)