SINGULUS TECHNOLOGIES, founded in 1996, continues to expand its activities in the segments Semiconductor, Solar and Optical Disc.
SINGULUS is a renowned manufacturer of advanced thin-film deposition equipment for MRAM, thin-film head, sensor and other semiconductor applications. It is the trusted partner in the respective industry and extends its leadership in the thin-film deposition technology for semiconductor applications.
SINGULUS has already established and qualified the second generation of the TIMARIS PVD Cluster Tool platform in the market and is offering a complete portfolio of process modules for different applications.
As of today, seven different process modules are available to configure a TIMARIS system according to customer needs. These modules include the Multi-Target-Module (MTM), Oxidation-Process-Module (OPM), Pre-Clean-Module (PCM), Combi-Process-Module (CPM), Flexible-Target-Module (FTM) and Static-PVD- Module (sPVD-M) as well as the ROTARIS sputtering system for special R&D applications.
The TIMARIS PVD modules (MTM, FTM, sPVD-M) incorporate the full scope of sputtering techniques as: DC magnetron sputtering, pulsed DC magnetron sputtering and RF magnetron sputtering as well as combinations of these modes are selectable by recipe.
Thin-Film Heads (TFH)
- High Moment Material (Writer Material)
- TMR (Reader Material)
- GMR (Reader Material)
- Deposition of seed and gap layers
- High-k dielectrics
- Metal gates
- Phase-change material deposition
- SAW/BAW film deposition
- In-circuit Inductors
All TIMARIS applications require the deposition of ultra-thin metallic and insulating film stacks down to a thickness of one nanometer and below with very precise material thickness and high uniformity specifications.
The MTM is the key component of the TIMARIS platform; it incorporates the Linear Dynamic Deposition (LDD, US patent US 7,799,179 B2) technology in combination with ten sputter targets in one vacuum chamber.
The FTM module uses Linear Dynamic Deposition in combination with up to four cathodes. The LDD technology is especially designed for deposition of ultra-thin films, magnetic films, high-quality metallic, conductive and insulating films and is the key to deliver world class material uniformity across large wafer sizes, combined with an exceptional precise control of ultra-thin layer thickness down to 1 % of a nanometer.
- Multi Target Module
Top: Target drum with 10 rectangular cathodes; drum design ensures easy maintenance;
Bottom: Main part of the chamber containing LDD equipment
- Oxidation Module
Low energy remote atomic plasma oxidation; natural oxidation; soft energy surface treatment
- PreClean Module
(PreClean, surface treatment)
- Transport Module
(UHV wafer handler)
- Load Port
(according to customer specification)
|Ultra-High-Vacuum Design:||Base Pressure < 5*10-9 Torr (Deposition Chamber)|
|High Throughput (e.g. MRAM):||up to 18 Wafer/h|
|High Effective Up-time:||Maintenance friendly Design|
|Reliability:||Solid and well Engineered Design, no fast moving Parts|