Technical features of the STANGL GERULUS Pre-Clean & Deglue System
- Proven, highly integrated design
- High throughput up to 7200 wph
- Built for non-stop utilization: 24/7, 365 days/year
- High availability (uptime > 95%)
- Sophisticated pre-cleaning concept for best
process results and minimal process times - Compliance with international safety regulations
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High flexibility in
- Wafer size (up to 210x210 mm)
- Wafer thickness (down to 150 µm)
- Slurry type to be removed (PEG- or oil-based)
- Glue type to be deglued (water or acid soluble)
- Process control through detailed recipe control
By using optimized process cassettes
- Lowest breakage rate
- Optimal integration with subsequent
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Superiously low cost-of-ownership
- Minimized fresh water consumption
- Use of patented recycling system
- Only 200 l of fresh water needed per block
- Minimal surfactant consumption
State-of-the-art material tracking by
- Network communication support
- Carrier tracking and data logging
- Manufacturing Execution System (MES) support
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