MATERIA PCE

Main Features 
  • Proven, highly integrated design based on
    STANGL’s SILEX
  • For poly silicon (electronic, solar or UMG grade)
  • Chunk sizes between 10 and 180 mm
    (other formats upon request)
  • Throughput: from 500 to p.a. to 2500 to p.a.
  • Built for non-stop utilization: 24/7, 365 days/year
  • High availability (uptime > 95 %)
  • Compliance with international safety regulations
  • Flexible coupling to adjacent processes by cart
    transportation system

Controlled, Precise, Intelligent

  • Real-time Siemens S7-300 plc control of wet bench
  • State-of-the-art full graphic user interface
  • Prepared for connection to Manufacturing
    Execution System (MES), e.g. via OPC, XML, or SECS/GEM
  • Network communication support
  • Carrier tracking and data logging

High Flexibility in Process Design

  • Acidic etching process, alkaline etching process,
    or combined process
  • Highly accurate dosaging
  • Multi-recipe management via graphical user
    interface or MES
  • Process support available

By Using Optimized Process Baskets

  • Short drying time
  • Minimized carry-over of water and acid

Low Cost-of-Ownership

  • Minimized fresh water consumption
  • Minimized chemical consumption
  • Continuous tracking of consumption data