Substrate Carrier Loading/Unloading
Module - One five-position turntable receiving substrate carriers, each transporting four wafers
- One H-Handling unit to transfer the uncoated wafers from the incoming conveyor into the carriers and unload the coated wafers from the carriers to the outgoing conveyor
- One camera system to position the incoming wafers very precisely into the substrate carriers
Heating Station The heating station is installed in the position
next to the load lock. The maximum heating
power density is up to 150 kW/m² for the whole array. This allows temperatures of up to 600 °C and heating ramps of up to 70 °C/s for the wafers (depending on the wafer type).
ICP – PECVD Deposition Station
Standard are three independently controlled
ICP-PECVD deposition stations. An additional
fourth one can be integrated into main vacuum
chamber for higher throughput or for additional
process steps like back side coating. The ICPPECVD process allows perfect control on film composition and density at a high deposition rate (ICP – Inductively Coupled Plasma).
Control Concept
The complete machine, including carrier loading and unloading module, is controlled via one central industrial PC. All safety interlocks are carried out by an additional integrated safety PLC. 19” touch screen displays allow convenient operation of the SINGULAR.
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