Applications

• Thin Film Heads (TFH)
  • High Moment Material (Writer – Material)
  • TMR (Reader Material)
  • GMR (Reader Material)
  • Other potential applications:
  • Deposition of seed and gap layers
• Semiconductor
  • MRAM
  • High-k dielectrics
  • Metal gates
  • Other potential applications:
  • Phase Change material deposition
  • Deposition of EUV mirrors for next generation of lithography
  • SAW/BAW film deposition
  • Inductors on chip

The Multi-Target-Module (MTM) as a key component of the TIMARIS PVD tool incorporates Linear Dynamic Deposition (LDD) technology in combination with ten (10) sputter targets in one vacuum chamber. This technology is especially designed for deposition of ultra–thin films, magnetic films, high–quality metallic, conductive and insulating films and multiple film stack deposition comprising these materials without the need to break ultra high vacuum. A collinear Aligning Magnetic Field (AMF) can be activated to align the magnetic Easy Axis during deposition of ferromagnetic films if required. The LDD technology is key to delivering world class material uniformity across large wafers and exceptional precise control of ultra thin layer thickness down to 1% of a nanometer.



Advanced Process Equipment

HamaTech plays a leading international role in the area of Advanced Process Equipment. The systems for production of photomasks are used in the semiconductor industry, by customers whose highest demands we take into account increasingly through our development partnerships. Equally high technology is also used in wafer production, micro-electromechanical systems (MEMS), telecommunications and chip packaging.

• Link to the HAMATECH APE Homepage