Modular Sputtering System for Different Applications

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HISTARIS Inline Sputtering System with Horizontal Substrate Transport

The SINGULUS TECHNOLOGIES system with the brand name HISTARIS was developed for the requirements in the photovoltaic industry but also for applications in large area sputtering like architectural glazing, fuel cells and mobile devices. In photovoltaics the Inline sputtering systems are important in today’s CIGS & CdTe thin-film solar cell production.

The HISTARIS system was designed to enhance the efficiency and cutting production costs by using the state-of-the-art technologies. The modular design includes process chambers equipped with rotatable magnetrons for the sputter deposition of highperformance TCO layers or several other materials, such as metals and metal oxides. Pre-treating modules for cleaning or etching can be added. With its unique modular design, the HISTARIS system is ideally suited for challenging layer stacks and flexible product mixes.

Examples are transparent front or metallic back contact layers as well as multilayered precursors with a broad range of different materials. The main advantage of the system is that it can be used for horizontal vacuum-based coating of glass substrates in the solar industry. Typical applications include anti-reflection layers, barrier layers and precursor layers but also different metallic layers such as Al, Cu, NiV and more.

For photovoltaic technology, SINGULUS TECHNOLOGIES develops and manufactures thin film deposition systems which can apply special layers and layer systems on different substrates. In the market for thin-film photovoltaic SINGULUS TECHNOLOGIES adds another production stage to its range of processing systems for the manufacture of CIGS & CdTe thin-film solar cells.

The HISTARIS is using an inline process in which the substrates are transported on specially designed carriers or directly on a customized roller drive system. Different automation options for loading and unloading are available.

Main Features HISTARIS

  • Modular machine concept
  • Integrated power supply design
  • Horizontal substrate transport – with and without carrier
  • Usage of rotatable cylindrical magnetron for highest utilization of target material
  • Highest deposition rates
  • Temperature processing before and during deposition available
  • Gas separation by dynamic slit valves and/or by individual lock chambers
  • Easy maintenance, low CoO
  • Fast target exchange, use any vendor target
  • Vacuum base pressure: ‹ 1 x 10-6 mbar
  • Typical process pressure: 2 - 5 x10-3 mbar

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