Ready for Triple Layer Blu-ray Discs

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SINGULUS TECHNOLOGIES developed a new replication line under the product name BLULINE III for the manufacturing of triple layer Blu-ray Discs with a storage capacity of 100 Gigabyte. The new production equipment by SINGULUS TECHNOLOGIES enables the production of next generation optical discs on the basis of the current BLULINE II machines for dual layer Blu-ray Discs. SINGULUS TECHNOLOGIES has already a large number of production lines at over 30 replicators around the globe and experience in the field of Blu-ray production. This goes back to its early,exclusive partnership with the format developer Sony in 2005.

Just in time for the market introduction of thenew ultra high definition television technology(UHD), SINGULUS TECHNOLOGIES completed thedevelopment of the production technology for the new triple layer Blu-ray Discs. The new generation of high definition television provides four times the resolution (3,840 x 2,160 pixels) of HDTV. The further advancement of today’s Blu-ray Discs, the triple layer Blu-ray Discs with 100 Gigabyte storage capacity, is the preferred playback medium for the new UHDtechnology. With the realization of a new and specifically designed data compression method for the ultra high definition technology, the storage volume per information layer can be increased from 25 GB to 33 GB. The Blu-ray Disc Association decided in May 2015 for a new, global standard.

The following features characterize the BLULINE III concept:

  • Dedicated to production of triple layer Blu-ray Discs
  • Based on proven BLULINE II concept
  • Using SINGULUS wet embossing technology
  • Highly integrated design
  • All production steps included
  • Thickness Measurement Device (TMD) for metallized layers with close loop control
  • Inline-Scanner for spacer layer and cover layer measuring with close loop control
  • High productivity, high uptime
  • Clear structured disc flow
  • Automated handling of BD through all production steps
  • Minimum space required

The most common technology for creating an additional information layer on a substrate surface is the wet-embossing process. The benefit of the wet-embossing process is that it provides a fine pit geometry and therefore generates a flawless electrical signal. The Layer 1 wet-embossing station is the key unit of the dual-layer application. This unit is built with a 4-position turntable and one embossing head. The Layer 1 stamper is mounted onto the top side of the embossing head. It is supported by vacuum and a mechanical stamper holder. The disc is loaded onto a quartz glass underneath the embossing head and the L1 Nickel stamper structures are embossed into the pit transfer resin and cured with UV light.

The complete process consists of the following production steps:

 1.  Molding BD L0 for BD TL
 2.  Metallization L0 (~40 nm)
 3.  Base-Resin S1 (22 μm)
 4.  Pit-Resin S1 (3 μm)
 5.  Pre-Curing S1
 6.  Wet-Embossing L1
 7.  Metallization L1 (~25 nm)
 8.  Base-Resin S2 (15 μm)
 9.  Pit-Resin S2 (3 μm)
10. Pre-Curing S2
11. Wet-Embossing L2
12. Metallization L2 (~25 nm)
13. Cover-Resin (54 μm)
14. Hardcoat-Resin (3 μm)
15. Barrier Layer (~10 nm)
16. Final Inspection


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