Main Characteristics LINEX

Typical Performance Characteristics

  • Inline from R & D tool to the fully integrated 10 lane system
  • Alkaline process up to 90 °C possible in 5 or 10 lane systems
  • Polish etch up to 10 μm
  • Integration of ozone
  • Uniform media  ow on wafer surface
  • Consistent  ow conditions from lane to lane
  • Easy integration of new or additional process options
  • High uptime up to 98 %
  • High throughput and best performance
  • Low cost of ownership
  • Low breakage rate down to 0.01 %
  • Best footprint
  • SSE application up to 5 μm

Controlled – Precise – Intelligent

  • Fully automated inline wet process equipment with integrated process control
  • Compact process modules with innovative media and process management
  • Simple and robust wafer transport system
  • Shadow-free contact of the wafer top surface with the process media
  • Wafer tracking and wafer thickness measurement

Safe – Clean – User Friendly

  • Safe for operators, environment and for reliable processing
  • Cleanroom compatible design according to ISO and SEMI standards
  • Gentle wafer transport through the process media
  • Excellent accessibility of the process modules from all sides

LINEX Process Applications

Final Clean (Mono & Multi):
Wafer cleaning after separation, with ultrasonic & additives

Alkaline Texture (Mono):
Top side etch with KOH and additives

Acidic Etching (Multi):
Saw damage removal and surface treatment

Single Side Etching (Mono & Multi):
Acidic rear side etching

Single Side Polish (Mono & Multi):
Acidic rear side polishing up to 5 μm

Ozone:
Advanced cleaning process

OK

Wir verwenden Cookies, um die Funktionsfähigkeit und Sicherheit dieser Website sicherzustellen. Zudem können Drittanbieter bei Aufruf einzelner Dokumente und Seiten Cookies einrichten. Mit der Nutzung dieser Website erklären Sie sich mit der Verwendung von Cookies einverstanden. Weitere Informationen finden Sie unter diesem Link.